Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17568167
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Filing Dt:
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01/04/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Yi-Hung CHIEN, Chun-Ying WANG, Te-Wei CHEN, Hsiu-Yuan CHEN, Bing-Ling WU
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Title:
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METHOD FORMING A SEMICONDUCTOR PACKAGE DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F-1, NO. 36, TAIYUAN ST. |
JHUBEI CITY, HSINCHU COUNTY, TAIWAN 302 |
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MCCLURE, QUALEY & RODACK, LLP |
280 INTERSTATE NORTH CIRCLE SE |
SUITE 550 |
ATLANTA, GA 30339 |
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05/20/2024 10:31 PM
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