Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17463047
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Filing Dt:
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08/31/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Vivek Swaminathan SRIDHARAN, Christopher Daniel MANACK, Jonathan Andrew MONTOYA et al
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Title:
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WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD |
| M/S 3999 |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| PO BOX 655474 |
| M/S 3999 |
| DALLAS, TX 75265 |
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