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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18045854
Filing Dt:
10/12/2022
Publication #:
Pub Dt:
03/02/2023
Inventors:
Stephen R. Barnes, Baik Woo Lee
Title:
CHIP-ON-ARRAY WITH INTERPOSER FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY
Assignment: 1
Reel/Frame:
061389/0127Recorded: 10/12/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/15/2018
Exec Dt:
11/15/2018
Assignee:
40 LIBERTY BLVD
MALVERN, PENNSYLVANIA 19355
Correspondent:
SARA HUARD
3850 QUADRANGLE BLVD
SIEMENS CORPORATION, IP DEPARTMENT
ORLANDO, FL 32817

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