Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17893016
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Filing Dt:
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08/22/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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In Soo KIM, Donghee Son, Hannah Kwon, Hye Jun Kim, Duhwan Seong, Jinhyun Kim
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Title:
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DEVICE ASSEMBLY, DEVICE MODULE INCLUDING THE DEVICE ASSEMBLY, AND DEVICE PACKAGE INCLUDING THE DEVICE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 HWARANG-RO 14-GIL, SEONGBUK-GU |
| SEOUL, KOREA, REPUBLIC OF 02792 |
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| 2066 SEOBU-RO, JANGAN-GU |
| GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 16419 |
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| AMPACC LAW GROUP, PLCC |
| 6100 219TH ST SW #580 |
| MOUNTLAKE TERRACE, WA 98043 |
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