Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17462769
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Filing Dt:
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08/31/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Chen-Hung LIN, Ya-Chin CHIU, Ming-Hsien LIN
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Title:
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PHYSICAL VAPOR DEPOSITION PROCESS APPARATUS AND METHOD OF OPTIMIZING THICKNESS OF A TARGET MATERIAL FILM DEPOSITED USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET NW |
| WASHINGTON, DC 20001 |
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