Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17799575
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Filing Dt:
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08/12/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Takahiro Matsufuji, Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei
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Title:
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Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder Joint
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23, SENJU-HASHIDO-CHO |
ADACHI-KU, TOKYO, JAPAN 120-8555 |
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THE WEBB LAW FIRM |
420 FORT DUQUESNE BLVD., STE. 1200 |
ONE GATEWAY CENTER |
PITTSBURGH, PA 15222 |
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05/05/2024 01:17 PM
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