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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
06/04/2024
Application #:
17412403
Filing Dt:
08/26/2021
Publication #:
Pub Dt:
03/02/2023
Inventors:
Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue et al
Title:
BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS
Assignment: 1
Reel/Frame:
057294/0225Recorded: 08/26/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/14/2020
Exec Dt:
12/15/2020
Exec Dt:
12/14/2020
Exec Dt:
12/14/2020
Exec Dt:
12/14/2020
Exec Dt:
01/11/2021
Exec Dt:
12/14/2020
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
ESCHWEILER & POTASHNIK, LLC
629 EUCLID AVE.
SUITE 1101
CLEVELAND, OH 44114

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