Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/2024
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Application #:
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17546470
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Filing Dt:
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12/09/2021
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Publication #:
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Pub Dt:
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03/09/2023
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Inventors:
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MING HE, ANTHONY DONGICK LEE, SEOWOO NAM, SANG HOON AHN, HARSONO SIMKA
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Title:
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INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| CANA CREECH |
| 4140 PARKLAKE AVENUE |
| 6TH FLOOR, SUITE 600 |
| RALEIGH, NC 27612 |
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05/14/2024 02:04 AM
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