Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17863594
|
Filing Dt:
|
07/13/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/09/2023
| | | | |
|
Inventors:
|
Soo Doo Chae, Sang Cheol Han, Hojin Kim, Kandabara Tapily, Satohiko Hoshino, Adam Gildea et al
|
|
Title:
|
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 107-6325 |
|
|
|
|
| FOLEY & LARDNER LLP |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
|
|
Search Results as of:
05/06/2024 11:52 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
