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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17474255
Filing Dt:
09/14/2021
Publication #:
20230082385
Pub Dt:
03/16/2023
Inventors:
Jeremy D. Ecton, Kristof Darmawikarta, Sashi S. Kandanur et al
Title:
DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A REVERSE FILLING ARCHITECTURE
Assignment: 1
Reel/Frame:
058689/0840Recorded: 01/11/2022Pages: 35
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ECTON, JEREMY D.
Exec Dt:
09/21/2021
DARMAWIKARTA, KRISTOF
Exec Dt:
09/21/2021
KANDANUR, SASHI S.
Exec Dt:
10/05/2021
PIETAMBARAM, SRINIVAS VENKATA RAMANUJA
Exec Dt:
09/21/2021
GRUJICIC, DARKO
Exec Dt:
11/02/2021
WALL, MARCEL ARLAN
Exec Dt:
09/21/2021
NAD, SUDDHASATTWA
Exec Dt:
09/22/2021
DUONG, BENJAMIN
Exec Dt:
09/21/2021
SHANMUGAM, RENGARAJAN
Exec Dt:
11/03/2021
NIE, BAI
Exec Dt:
09/21/2021
CASTRO DE LA TORRE, HELME
Exec Dt:
11/03/2021
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402

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