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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18046662
Filing Dt:
10/14/2022
Publication #:
Pub Dt:
03/16/2023
Inventors:
Takehito SHIMATSU, Miyuki UOMOTO, Yoshikazu MIYAMOTO, Takayuki MORIWAKI, Kazuo MIYAMOTO et al
Title:
METHOD FOR ATOMIC DIFFUSION BONDING AND BONDED STRUCTURE
Assignment: 1
Reel/Frame:
061426/0902Recorded: 10/14/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/28/2022
Exec Dt:
09/28/2022
Exec Dt:
09/22/2022
Exec Dt:
09/22/2022
Exec Dt:
09/21/2022
Exec Dt:
09/22/2022
Exec Dt:
09/22/2022
Assignees:
2-1-1, KATAHIRA, AOBA-KU
SENDAI-SHI, MIYAGI, JAPAN 9808577
2-5-1, KURIGI, ASAO-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 2158550
Correspondent:
BUCHANAN INGERSOLL & ROONEY PC
1737 KING STREET, SUITE 500
ALEXANDRIA, VA 22314-2727

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