Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17932864
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Filing Dt:
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09/16/2022
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Publication #:
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Pub Dt:
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03/16/2023
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Inventors:
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Abderrazzaq IFIS, Lukas HERRES, Julia PLATZER, Jens RIEDLER, Felix SKRIVANEK
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Title:
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Forming Through Hole in Component Carrier by Laser Drilling Blind Hole and Extending the Latter by Etching
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FABRIKSGASSE 13 |
| LEOBEN, AUSTRIA 8700 |
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| SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM |
| 1600 PARKWOOD CIRCLE SE, SUITE 620 |
| ATLANTA, GA 30339 |
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06/06/2024 05:36 AM
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