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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17688418
Filing Dt:
03/07/2022
Publication #:
20230089079
Pub Dt:
03/23/2023
Inventors:
Wooram HONG, Hyun Do Choi, Dal Heo, Youngchun Kwon, Hyukju Kwon, Gahee Kim, Bosung Kim et al
Title:
SEALING STRUCTURE AND MATERIAL CONTAINING DEVICE INCLUDING THE SAME
Assignment: 1
Reel/Frame:
059187/0825Recorded: 03/07/2022Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HONG, WOORAM
Exec Dt:
02/18/2022
CHOI, HYUN DO
Exec Dt:
02/18/2022
HEO, DAL
Exec Dt:
02/22/2022
KWON, YOUNGCHUN
Exec Dt:
02/22/2022
KWON, HYUKJU
Exec Dt:
02/23/2022
KIM, GAHEE
Exec Dt:
02/22/2022
KIM, BOSUNG
Exec Dt:
02/22/2022
KIM, JEONGHUN
Exec Dt:
02/22/2022
KIM, JIN WOO
Exec Dt:
02/22/2022
PARK, MIN SIK
Exec Dt:
02/22/2022
PARK, YOUNGJIN
Exec Dt:
02/22/2022
SEO, HYUNGTAE
Exec Dt:
02/22/2022
OH, WON SEOK
Exec Dt:
02/18/2022
LEE, DONGSEON
Exec Dt:
02/23/2022
LEE, SANGYOON
Exec Dt:
02/18/2022
CHANG, JAEJUN
Exec Dt:
02/22/2022
JANG, JUN-WON
Exec Dt:
02/22/2022
JEON, HYUNJEONG
Exec Dt:
02/22/2022
CHO, JOON-KEE
Exec Dt:
02/21/2022
CHOI, BYUNG-KWON
Exec Dt:
02/23/2022
CHOI, WON JE
Exec Dt:
02/18/2022
CHOI, YOUNSUK
Exec Dt:
02/18/2022
HA, TAESIN
Exec Dt:
02/18/2022
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondent:
SUGHRUE MION, PLLC
2000 PENNSYLVANIA AVENUE, N.W.
SUITE 9000
WASHINGTON, DC 20006

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