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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17885076
Filing Dt:
08/10/2022
Publication #:
Pub Dt:
03/23/2023
Inventors:
Shinya MORITA, Seiyo NAKASHIMA, Yoshitaka ABE, Kazuhiro HARADA, Yasunobu KOSHI et al
Title:
FURNACE OPENING STRUCTURE, SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
061143/0515Recorded: 08/10/2022Pages: 31
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/08/2022
Exec Dt:
07/07/2022
Exec Dt:
07/25/2022
Exec Dt:
08/09/2022
Exec Dt:
07/07/2022
Exec Dt:
07/07/2022
Assignee:
3-4, KANDAKAJI-CHO, CHIYODA-KU
TOKYO, JAPAN 101-0045
Correspondent:
VOLPE KOENIG
30 SOUTH 17TH STREET, 18TH FLOOR
PHILADELPHIA, PA 19103

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