Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17478556
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Filing Dt:
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09/17/2021
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Publication #:
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Pub Dt:
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03/23/2023
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Inventors:
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Chin Poh Pang, Gang Chen
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Title:
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DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING NO.8, IC PARK |
| NO.9, FENGHAO EAST ROAD, HAIDIAN |
| BEIJING, CHINA 100088 |
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| HAYNES AND BOONE, LLP IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, 75219 UNITED STATES |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING NO. 6, NO.10 KEGU ONE STREET |
| ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA |
| BEIJING, CHINA 100176 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE, SUITE 700 |
| IP SECTION |
| DALLAS, TX 75219 |
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