Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17787922
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Filing Dt:
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06/21/2022
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Publication #:
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Pub Dt:
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03/23/2023
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Inventors:
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Seung Uk YEU, Jung Eun KIM, Won Sang KWON, Jung Su HAN, Myung Su JANG, Sayaka HOSHINO et al
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Title:
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DIP-FORMED ARTICLE COMPRISING A LAYER DERIVED FROM LATEX COMPOSITION FOR DIP-FORMING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| 4-3, HIROO 5-CHOME, SHIBUYA-KU |
| TOKYO, JAPAN 1508455 |
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| COLLIN W. PARK |
| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20004 |
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