Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17908118
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Filing Dt:
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08/30/2022
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Publication #:
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Pub Dt:
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03/23/2023
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Inventors:
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Liqiang CAO, Yangyang YAN, Peng SUN, Tianfang CHEN, Fengwei DAI
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Title:
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WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTED STRUCTURE AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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778 CHUANGXIN WEST ROAD, PILOT FREE TRADE ZONE |
PUDONGXIN DISTRICT |
SHANGHAI, CHINA 200131 |
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BUILDING D1,CHINA SENSOR NETWORK INTERNATIONAL |
INNOVATION PARK, 200 LINGHU BOULEVARD, XINWU DIST. |
WUXI, JIANGSU, CHINA 214135 |
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R. BURNS ISRAELSEN |
MASCHOFF BRENNAN |
111 S MAIN ST #600 |
SALT LAKE CITY, UT 84111 |
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