Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17801440
|
Filing Dt:
|
08/22/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/23/2023
| | | | |
|
Inventors:
|
Yohei NISHIDA, Soichiro MORIKAWA
|
|
Title:
|
SOLID PREPARATION
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 6-8, DOSHOMACHI 2-CHOME, CHUO-KU |
| OSAKA-SHI |
| OSAKA, JAPAN 541-0045 |
|
|
|
| TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME, |
| HORIKAWA-DORI, KAMIGYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 602-8585 |
|
|
|
|
| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
|
|
Search Results as of:
05/14/2024 05:31 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
