Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17876067
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Filing Dt:
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07/28/2022
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Publication #:
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Pub Dt:
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03/23/2023
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Inventors:
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Atsushi AMO, Hiraku CHAKIHARA, Hiroshi YANAGITA, Akio ONO
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Title:
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MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-24, TOYOSU 3-CHOME, KOTO-KU |
| TOKYO, JAPAN 135-0061 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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