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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17931940
Filing Dt:
09/14/2022
Publication #:
Pub Dt:
03/30/2023
Inventors:
You Ge, Zhijie Wang, Yit Meng Lee
Title:
Type of bumpless and wireless semiconductor device
Assignment: 1
Reel/Frame:
061088/0623Recorded: 09/14/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/08/2022
Exec Dt:
09/08/2022
Exec Dt:
09/08/2022
Assignee:
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TX 78735

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