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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	17948318	Filing Dt:	09/20/2022
Publication #:	20230098430	Pub Dt:	03/30/2023
Inventors:	Hirotaka MIYANO, Masami SAITO, Kazuhiro MORITA, Taiga HANDA, Katsuhito MORI, Kunio MORI
Title:	BONDED STRUCTURE

Assignment: 1

Reel/Frame:

Recorded: 12/01/2022

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

Exec Dt:

10/24/2022

Exec Dt:

11/01/2022

Exec Dt:

10/24/2022

Exec Dt:

10/25/2022

Exec Dt:

10/25/2022

Exec Dt:

10/28/2022

Assignee:

1-1, SHOWA-CHO

KARIYA-CITY, AICHI-PREF., JAPAN 448-8661

Correspondent:

HARNESS, DICKEY & PIERCE, P.L.C.

5445 CORPORATE DRIVE

SUITE 200

TROY, MI 48098

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