Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17681496
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Filing Dt:
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02/25/2022
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Publication #:
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Pub Dt:
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03/30/2023
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Inventors:
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Seiichi HITOMI, Keita TAKAHASHI, Teruki NIORI, Daisuke HAYASHI
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Title:
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COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26-30, NISHIAZABU 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 106-8620 |
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| SUGHRUE |
| 2000 PENNSYLVANIA AVENUE, NW |
| SUITE 900 |
| WASHINGTON, DC 20006-1811 |
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