Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17802045
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Filing Dt:
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08/24/2022
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Publication #:
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Pub Dt:
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03/30/2023
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Inventors:
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Toshihiko MATSUKURA, Nozomi OGUCHI, Yoshinori TAKASHIMA, Akira HARADA, Motofumi OSAKI
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Title:
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RESIN MATERIAL INCLUDING SILOXANE-BOND-CONTAINING POLYMER HAVING HOST GROUP AND/OR GUEST GROUP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-5, GINZA 7-CHOME |
| CHUO-KU, TOKYO, JAPAN 104-0061 |
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| 1-1, YAMADAOKA |
| SUITA-SHI, OSAKA, JAPAN 565-0871 |
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| STEPHEN B. MAEBIUS |
| FOLEY & LARDNER LLP |
| 3000 K STREET NW SUITE 500 |
| WASHINGTON, DC 20007-5109 |
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