Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17942506
|
Filing Dt:
|
09/12/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/30/2023
| | | | |
|
Inventors:
|
Sumire Tanaka, Daigo Ichikawa, Yurika Munekawa
|
|
Title:
|
SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-19-43, HIGASHI-OIZUMI |
| NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
|
|
|
|
| RANKIN HILL AND CLARK LLP |
| 38210 GLENN AVENUE |
| WILLOUGHBY, OH 44094 |
|
|
Search Results as of:
05/13/2024 04:54 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
