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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18063670
Filing Dt:
12/08/2022
Publication #:
20230105582
Pub Dt:
04/06/2023
Inventors:
SU-LIN LOW, TIANAN TIM MA, HONG KUI YANG, HAUSTING HONG, CHUN-I LEE, JIANZHOU LI
Title:
MODULAR 5G UE LAYER-2 DATA STACK SOLUTIONS FOR HIGH THROUGHPUT AND LOW LATENCY DATA TRANSFER
Assignment: 1
Reel/Frame:
062034/0011Recorded: 12/08/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LOW, SU-LIN
Exec Dt:
11/30/2022
MA, TIANAN TIM
Exec Dt:
11/30/2022
YANG, HONG KUI
Exec Dt:
12/07/2022
HONG, HAUSTING
Exec Dt:
11/30/2022
LEE, CHUN-I
Exec Dt:
12/01/2022
LI, JIANZHOU
Exec Dt:
12/07/2022
Assignee:
ZEKU, INC.
2479 E. BAYSHORE ROAD
SUITE 260
PALO ALTO, CALIFORNIA 94303
Correspondent:
PERKINS COIE LLP - PAO GENERAL
P.O. BOX 1247
SEATTLE, WA 98111-1247
Assignment: 2
Reel/Frame:
064338/0281Recorded: 07/21/2023Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
ZEKU, INC.
Exec Dt:
07/06/2023
Assignee:
ZEKU TECHNOLOGY (SHANGHAI) CORP., LTD.
ROOM 01, FLOOR 8, NO. 1, LANE 61, SHENGXIA ROAD,
CHINA (SHANGHAI) PILOT FREE TRADE ZONE, PUDONG NEW DISTRICT
SHANGHAI, CHINA 200120
Correspondent:
PERKINS COIE LLP
PO BOX 1247
SEATTLE, WA 98111-1247

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