Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17798833
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Filing Dt:
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08/10/2022
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Publication #:
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Pub Dt:
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04/06/2023
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Inventors:
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Tomohiro UNO, Tetsuya OYAMADA, Daizo ODA, Kota SHIMOMURA, Tadashi YAMAGUCHI
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Title:
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COPPER BONDING WIRE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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04/29/2024 03:02 PM
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