Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17706232
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Filing Dt:
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03/28/2022
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Publication #:
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Pub Dt:
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04/13/2023
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Inventors:
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Teng-Hao YEH, Meng-Yen WU
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Title:
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3D CIRCUIT STRUCTURE WITH STAIRSTEP CONTACT CONFIGURATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 16 LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| MACRONIX C/O HAYNES BEFFEL & WOLFELD LLP |
| P. O. BOX 366 |
| ANDREW L. DUNLAP |
| HALF MOON BAY, 94019 UNITED STATES |
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