Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17988847
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Filing Dt:
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11/17/2022
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Publication #:
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Pub Dt:
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04/13/2023
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Inventors:
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Noriko KANO, Tomoyuki SHIRASAKI, Susumu MANIWA
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Title:
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MULTILAYER WIRING SUBSTRATE AND MODULE HAVING MULTILAYER WIRING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TOPPAN KOISHIKAWA HQ BUILDING |
| 1-3-3 SUIDO |
| BUNKYO-KU, TOKYO, JAPAN 112-8531 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET NW |
| WASHINGTON, DC 20007 |
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