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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/13/2023
Application #:
17450186
Filing Dt:
10/07/2021
Publication #:
Pub Dt:
04/13/2023
Inventors:
Uzma B. Rana, Anthony K. Stamper, Steven M. Shank
Title:
IC STRUCTURE INCLUDING POROUS SEMICONDUCTOR LAYER UNDER TRENCH ISOLATIONS ADJACENT SOURCE/DRAIN REGIONS
Assignment: 1
Reel/Frame:
057728/0460Recorded: 10/07/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/06/2021
Exec Dt:
10/06/2021
Exec Dt:
10/06/2021
Assignee:
400 STONEBREAK ROAD EXTENSION
MALTA, NEW YORK 12020
Correspondent:
HOFFMAN WARNICK LLC
540 BROADWAY
4TH FLOOR
ALBANY, NY 12207

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