Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/28/2023
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Application #:
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17500590
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Filing Dt:
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10/13/2021
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Publication #:
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Pub Dt:
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04/13/2023
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Inventor:
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Evan Cosentino
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Title:
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Apparatus and Method for Encapsulating an Electronic Component
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BRUGGERSTRASSE 66 |
BADEN, SWITZERLAND 5400 |
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DAVID P. MADIO |
LEYDIG, VOIT & MAYER, LTD. |
180 NORTH STETSON AVE., SUITE 4900 |
CHICAGO, IL 60601-6731 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 18, SEC. 2, ZHONGYANG S. RD. |
BEITOU DIST. |
TAIPEI CITY, TAIWAN 112030 |
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MICHAEL M. GNIBUS |
ARMSTRONG TEASDALE LLP |
7700 FORSYTH BLVD, SUITE 1800 |
ST. LOUIS, MO 63105 |
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