Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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17832573
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Filing Dt:
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06/04/2022
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Publication #:
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Pub Dt:
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04/13/2023
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Inventor:
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Yun Hwa Hong
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Title:
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APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU |
| CHEONAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF |
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| LADAS & PARRY LLP |
| 4525 WILSHIRE BLVD. SUITE 240 |
| LOS ANGELES, CA 90010 |
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