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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17669652
Filing Dt:
02/11/2022
Publication #:
Pub Dt:
04/20/2023
Inventors:
Fong-yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Ching-Yi Lin, Po-Yu Chen et al
Title:
SYSTEMS AND METHODS OF ESTIMATING THERMAL PROPERTIES OF SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
060452/0824Recorded: 07/07/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/06/2022
Exec Dt:
07/05/2022
Exec Dt:
02/06/2022
Exec Dt:
01/06/2022
Exec Dt:
01/13/2022
Exec Dt:
01/13/2022
Assignee:
NO. 8, LI-HSIN 6 ROAD
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
FOLEY & LARDNER LLP
500 WOODWARD AVENUE
SUITE 2700
DETROIT, MI 48226

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