Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18078157
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Filing Dt:
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12/09/2022
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Publication #:
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Pub Dt:
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04/20/2023
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Inventors:
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Lei WANG, Megan Hoarfrost BEERS, Ting GAO
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Title:
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Elastomeric Conductive Composite Interconnect
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MÜHLENSTRASSE 26 |
| SCHAFFHAUSEN, SWITZERLAND 8200 |
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| DEBBIE GAGLIANO |
| 1300 PENNSYLVANIA AVENUE, NW, SUITE 700 |
| WASHINGTON, DC 20004 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| MÜHLENSTRASSE 26 |
| SCHAFFHAUSEN, SWITZERLAND 8200 |
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| DEBBIE GAGLIANO |
| 1300 PENNSYLVANIA AVENUE, NW, SUITE 700 |
| WASHINGTON, DC 20004 |
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