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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17888006
Filing Dt:
08/15/2022
Publication #:
Pub Dt:
04/20/2023
Inventor:
Florian Herrault
Title:
Thermal Isolation Between Embedded MECA Modules
Assignment: 1
Reel/Frame:
061642/0661Recorded: 11/03/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/12/2022
Assignee:
3011 MALIBU CANYON ROAD
MALIBU, CALIFORNIA 90265
Correspondent:
LADAS & PARRY LLP
4525 WILSHIRE BLVD # 240
LOS ANGELES, CA 90010

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