Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17884845
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Filing Dt:
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08/10/2022
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Publication #:
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Pub Dt:
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04/20/2023
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Inventors:
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Min-Sheng KAO, ChunFu WU, Chung-Hsin FU, QianBing YAN, LinChun LI, Chih-Wei YU et al
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Title:
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CO-PACKAGED INTEGRATED OPTOELECTRONIC MODULE AND CO-PACKAGED OPTOELECTRONIC SWITCH CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 801, BUILDING 1, NO. 1, YI LE ROAD, SONGSHAN LAKE PARK |
| DONGGUAN CITY, GUANGDONG PROVINCE, CHINA |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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