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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/26/2023
Application #:
17509604
Filing Dt:
10/25/2021
Publication #:
Pub Dt:
04/27/2023
Inventors:
Xinshu Cai, Shyue Seng Tan, Vibhor Jain, John J. Pekarik, Kien Seen Daniel Chong et al
Title:
TRANSISTOR WITH WRAP-AROUND EXTRINSIC BASE
Assignment: 1
Reel/Frame:
057901/0631Recorded: 10/25/2021Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/15/2021
Exec Dt:
10/15/2021
Exec Dt:
10/22/2021
Exec Dt:
10/18/2021
Exec Dt:
10/15/2021
Exec Dt:
10/15/2021
Exec Dt:
10/14/2021
Exec Dt:
10/14/2021
Exec Dt:
10/22/2021
Assignee:
60 WOODLANDS INDUSTRIAL PARK D STREET 2
SINGAPORE, SINGAPORE 738406
Correspondent:
ANDREW M. CALDERON
7918 JONES BRANCH DRIVE, SUITE 500
MCLEAN, VA 22102

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