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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18047348
Filing Dt:
10/18/2022
Publication #:
Pub Dt:
04/27/2023
Inventor:
Akihiro TAKEUCHI
Title:
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
061453/0141Recorded: 10/18/2022Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/04/2022
Assignee:
80, OSHIMADA-MACHI, NAGANO-SHI,
NAGANO, JAPAN 381-2287
Correspondent:
IPUSA, P.L.L.C
1054 31ST STREET, N.W.
SUITE 400
WASHINGTON, DC 20007

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