Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17452129
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Filing Dt:
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10/25/2021
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Publication #:
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Pub Dt:
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04/27/2023
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Inventors:
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Nicholas A. Polomoff, Thomas Houghton, Yusheng Bian
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Title:
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PIC DIE AND PACKAGE WITH MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTIONS OF FIBERS TO ON-CHIP OPTICAL COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 400 STONEBREAK ROAD EXTENSION |
| MALTA, NEW YORK 12020 |
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| HOFFMAN WARNICK LLC |
| 540 BROADWAY |
| 4TH FLOOR |
| ALBANY, NY 12207 |
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