Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17886002
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Filing Dt:
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08/11/2022
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Publication #:
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Pub Dt:
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05/04/2023
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Inventor:
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Ryuichi ISHII
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Title:
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RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008310 |
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| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA, N.W. |
| SUITE 9000 |
| WASHINGTON, DC 20006 |
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04/27/2024 01:58 PM
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