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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17804178
Filing Dt:
05/26/2022
Publication #:
Pub Dt:
05/04/2023
Inventors:
JUN XIA, SHIJIE BAI
Title:
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
Assignment: 1
Reel/Frame:
060027/0537Recorded: 05/26/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/24/2022
Exec Dt:
05/24/2022
Assignee:
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK
ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA
HEFEI, ANHUI, CHINA 230601
Correspondent:
SYNCODA LLC
208 EUPHORIA CIR
CARY, NC 27519

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