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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18088765
Filing Dt:
12/26/2022
Publication #:
Pub Dt:
05/04/2023
Inventors:
Jung Hun LIM, Jin Uk LEE, Jae Wan PARK
Title:
COMPOSITION FOR ETCHING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Assignment: 1
Reel/Frame:
062205/0352Recorded: 12/26/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/08/2018
Exec Dt:
10/08/2018
Exec Dt:
10/08/2018
Assignee:
34, PANGYO-RO 255BEON-GIL, BUNDANG-GU
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 13486
Correspondent:
JONGKOOK PARK
5105 CLAYBANK LN
CENTREVILLE, VA 20120

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