Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18001870
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Filing Dt:
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12/15/2022
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Publication #:
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Pub Dt:
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05/04/2023
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Inventor:
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Shinsuke MIYAZAWA
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Title:
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RESIN COMPOSITION AND METHOD OF PRODUCING SAME, SHAPING MATERIAL, PACKAGING CONTAINER, AND SEMICONDUCTOR CONTAINER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-2, MARUNOUCHI 1-CHOME, |
| CHIYODA-KU, TOKYO, JAPAN 1008246 |
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| KENJA IP LAW PC |
| 4 NORTH SECOND STREET, SUITE 598 |
| SAN JOSE, CA 95113 |
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05/15/2024 08:08 AM
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