Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17910991
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Filing Dt:
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09/12/2022
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Publication #:
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Pub Dt:
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05/04/2023
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Inventors:
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Byung Yong LEE, Ung Ju LEE
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Title:
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METHOD OF EVALUATING INSULATION OF OVERLAY PART
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TOWER 1, 108, YEOUI-DAERO |
| YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07335 |
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| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE NW |
| WASHINGTON, DC 20004-2541 |
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06/01/2024 06:38 AM
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