Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17910607
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Filing Dt:
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09/09/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Inventors:
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Hiroshi Kobayashi, Tatsuo Kibe, Satoshi Kashiwaya
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Title:
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THERMALLY CONDUCTIVE PASTE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 1058716 |
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| LOCKE LORD LLP |
| 701 8TH ST NW, SUITE 500 |
| WASHINGTON, DC 20001 |
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