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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18053959
Filing Dt:
11/09/2022
Publication #:
Pub Dt:
05/11/2023
Inventors:
Delphine NEEL, David BITAULD
Title:
METHOD FOR ON-SILICON INTEGRATION OF A COMPONENT III-V AND ON-SILICON INTEGRATED COMPONENT III-V
Assignment: 1
Reel/Frame:
062471/0238Recorded: 01/24/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/2022
Exec Dt:
11/29/2022
Assignees:
25 RUE LEBLANC, BATIMENT LE PONANT D
PARIS, FRANCE 75015
TOUR CARPE DIEM PLACE DES COROLLES, ESPLANADE NORD
COURBEVOIE, FRANCE 92400
Correspondent:
OBLON, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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