Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17985688
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Filing Dt:
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11/11/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Inventors:
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Takayasu Shimizu, Hiroyuki Shimizu
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Title:
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Molded Parts for Low Temperature Applications, Especially for Liquid Hydrogen
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1171-105 NASHIGAHARA, KAMIGORI-CHO |
| AKO-GUN, HYOGO, JAPAN 678-1244 |
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| J-PAT U.S. PATENT LEGAL SERVICES |
| 8-1 NISHITEMMA 2-CHOME, KITA-KU |
| OOE BUILDING, NO. 508 |
| OSAKA-SHI, 530-0047 JAPAN |
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05/21/2024 12:53 PM
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