Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17782520
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Filing Dt:
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06/03/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Inventors:
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Nicholas Samuel Celia Jr., Cyriac Devasia
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Title:
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DIE BONDING SYSTEM WITH WAFER LIFT AND LEVEL ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 554 CLARK ROAD |
| TWEKSBURY, MASSACHUSETTS 01876 |
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| MAINE CERNOTA & RARDIN |
| 547 AMHERST ST., 3RD FLOOR |
| NASHUA, NH 03063 |
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