Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17640870
|
Filing Dt:
|
03/07/2022
|
|
Publication #:
|
|
Pub Dt:
|
05/18/2023
| | | | |
|
Inventors:
|
Seo Hwa KIM, Sejin HAN, Seongkyun KIM, Byoung Il KANG, Yeongmin KIM
|
|
Title:
|
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
|
|
|
|
| ALIA M. ORBIN |
| MORGAN, LEWIS & BOCKIUS LLP |
| 1701 MARKET STREET, |
| PHILADELPHIA, PA 19103-2921 |
|
|
Search Results as of:
06/14/2024 06:06 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
