Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17917313
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Filing Dt:
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10/06/2022
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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Keiichiro TOGAWA, Hironao SASAKI
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Title:
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COPOLYMERIZED POLYESTER RESIN, MOLDED PRODUCT, HEAT-SHRINKABLE FILM, AND FIBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-1, UMEDA 1-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 530-0001 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| 1025 CONNECTICUT AVENUE, N.W. |
| SUITE 500 |
| WASHINGTON, DC 20036 |
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