Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18155712
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Filing Dt:
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01/17/2023
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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YUHENG HUANG, SHENGJIN SONG, YICHENG FENG, BANG CHEN
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Title:
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METHOD FOR STACKING MULTI-LAYER WAFERS, AND SYSTEM FOR STACKING MULT-LAYER WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE |
WUHAN, CHINA |
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ANDREW C. CHENG |
516 N. DIAMOND BAR BLVD, #310 |
DIAMOND BAR, CA 91765 |
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05/26/2024 07:50 AM
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